Modular MEMS Pressure Sensors: Structure and Manufacturing
An explanation of patent ZL 2020 2 1471525.0: four manufacturing modules, assembly considerations and the difference between an uncompensated core and a complete transmitter.
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Standard Sensor Interfaces: Moulded Connections and Selection
Patent ZL 2020 2 2290530.8 explains a moulded connection between the sensor housing, pins and insulating socket. Learn what to check when matching electrical interfaces.
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Metri-P Sensor Interfaces: Construction and Harness Matching
An explanation of Metri-P connection patent ZL 2020 2 1897208.5, covering the housing, substrate, pins and moulded socket, with practical harness-matching checks.
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Hirschmann Sensor Interfaces: Retention and Wiring Checks
Patent ZL 2020 2 1897234.8 explains a sensor connector with a housing, substrate, locking nut, pins and moulded socket. Review mating-plug, wiring and protection conditions.
